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TECHNOLOGY LIBRARY

A
  • ACF Laminating/Pre-Bonding
  • B
  • Bolt & Studwelding
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  • Brazing
  • C
  • Compacting
  • D
  • Dispensing
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  • Drawn Arc Welding
  • E
  • Electrostatic Discharge Control
  • F
  • Fiber Laser Marking
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  • Fiber Laser Welding
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  • Fluid Dispensing
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  • Fume Extraction
  • G
  • Gap Welding
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  • Green Laser Welding
  • H
  • Heat Staking
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  • Heat-Sealing/ACF Final Bonding
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  • Hermetic Sealing of electronic packages
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  • Hot Bar Bonding
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  • Hot Bar Reflow Soldering
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  • Hot Bar Systems
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  • Hot Crimping
  • I
  • Induction Heating
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  • Inscribe
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  • Insulated Wire Welding
  • J
  • Jet Dispensing
  • L
  • Laser Cutting
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  • Laser Marking
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  • Laser Marking Systems
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  • Laser Seam Welding
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  • Laser Spot Welding
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  • Laser Welding
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  • Laser Welding Systems
  • M
  • Marking
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  • Micro Joining
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  • Micro Resistance Welding
  • P
  • Parallel Gap Welding
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  • Plastic Welding
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  • Projection Welding
  • R
  • Remote Services
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  • Resistance Welding
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  • Resistance Welding Systems
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  • Robotic Soldering
  • S
  • Saw Blade System
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  • Seam Welding
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  • Short Cycle Studwelding
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  • Single Component Positive Displacement Dispensing
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  • Single Component Time/Pressure Dispensing
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  • Spot Welding
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  • Strand Welding
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  • Studwelding
  •  
  • Studwelding with Capacitor Discharge
  • T
  • Thermocompression Welding
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  • Two Component Dispensing
  • W
  • Weld Monitoring
  •  
  • Welding
  • ACF Laminating/Pre-Bonding

    ACF Laminating ProcessAMADA MIYACHI EUROPE offers ACF Laminating/Pre-Bonding as a proven technology integrated in our systems. A well-known application of ACF Laminating/pre-Bonding is connecting flex-foil to glass or flex-foil to PCB. For example, Conductive Film (CF) materials are commonly used for OLED & Solar Cell applications.

    ACF Bonding (Anisotropic Conductive Film)
    The ACF Bonding process is used for fine-pitch applications (> 30 mircon), as the particle size is smaller than those of heat seal connectors (HSC's). The ACF Bonding process is a two- or three-step process:

    Step 1: ACF Laminating / Pre-Bonding
    The ACF material is supplied as a reel and consists of adhesive filled with conductive particles and a protective layer. Prior to ACF Laminating/Pre-Bonding the ACF to the substrate, the ACF tape is pre-cut at the required length of ACF from a reel of ACF. Cutting is done using the half-cut method where on the actual ACF material is cut, the cover-layer is used for tape transport. The ACF is now positioned over the bond surface, by placing the thermode
    (Hot bar) on the ACF material the ACF Laminating/Pre-Bonding is achieved.

    Step 2: Pre-Bonding of parts (not always required)

    Step 3: ACF Final Bonding
    Once ACF Laminating/Pre-Bonding is completed and the flex has been aligned to match the traces on the substrate, the thermode (Hot bar) is again actuated and the parts heated to bonding temperature for the ACF Final Bond cycle. 


    Applications ACF Laminating

     

    ACF Laminating/Pre-Bonding Benefits:
     

    • Small pitch possible
       

    • Electrical connections to glass
       

    • Lead-free process
       

    • Flux-free process
       

    • No cleaning required after process

    Applications in ACF Laminating/pre-Bonding
    Typical ACF Laminating/pre-Bonding application examples are connecting flex-foils to Printed Circuit boards (used in IT & Multimedia) detector modules, displays, etc. Our proven technologies enable the Automotive, IT & Multimedia, Electronics & Solar Cells, Aerospace, Defence and Medical industries to supply a variety of applications in ACF Laminating/pre-Bonding.

    Automotive IT & Multimedia Electronics & Solar Cells

     

     
     
    More information
     

    RELATED PRODUCTS

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