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TECHNOLOGY LIBRARY

A
  • ACF Laminating/Pre-Bonding
  • B
  • Bolt & Studwelding
  •  
  • Brazing
  • C
  • Compacting
  • D
  • Dispensing
  •  
  • Drawn Arc Welding
  • E
  • Electrostatic Discharge Control
  • F
  • Fiber Laser Marking
  •  
  • Fiber Laser Welding
  •  
  • Fluid Dispensing
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  • Fume Extraction
  • G
  • Gap Welding
  •  
  • Green Laser Welding
  • H
  • Heat Staking
  •  
  • Heat-Sealing/ACF Final Bonding
  •  
  • Hermetic Sealing of electronic packages
  •  
  • Hot Bar Bonding
  •  
  • Hot Bar Reflow Soldering
  •  
  • Hot Bar Systems
  •  
  • Hot Crimping
  • I
  • Induction Heating
  •  
  • Inscribe
  •  
  • Insulated Wire Welding
  • J
  • Jet Dispensing
  • L
  • Laser Cutting
  •  
  • Laser Marking
  •  
  • Laser Marking Systems
  •  
  • Laser Seam Welding
  •  
  • Laser Spot Welding
  •  
  • Laser Welding
  •  
  • Laser Welding Systems
  • M
  • Marking
  •  
  • Micro Joining
  •  
  • Micro Resistance Welding
  • P
  • Parallel Gap Welding
  •  
  • Plastic Welding
  •  
  • Projection Welding
  • R
  • Remote Services
  •  
  • Resistance Welding
  •  
  • Resistance Welding Systems
  •  
  • Robotic Soldering
  • S
  • Saw Blade System
  •  
  • Seam Welding
  •  
  • Short Cycle Studwelding
  •  
  • Single Component Positive Displacement Dispensing
  •  
  • Single Component Time/Pressure Dispensing
  •  
  • Spot Welding
  •  
  • Strand Welding
  •  
  • Studwelding
  •  
  • Studwelding with Capacitor Discharge
  • T
  • Thermocompression Welding
  •  
  • Two Component Dispensing
  • W
  • Weld Monitoring
  •  
  • Welding
  • Heat-Sealing/ACF Final Bonding

    Heat SealingThe process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils is referred to as Heat-Sealing or ACF Final Bonding. The essential characteristics of this process are heating and cooling of the adhesive under pressure. 

    Small adhesive particles or spheres are suspended in the adhesive, which can be in the form of foil, flex or paste. Before bonding the particles are separated by an isolating matrix of adhesive. The parts to be joined are first brought together with the adhesive in between. Temperature, time and pressure are applied and cause plastic deformation of the adhesive and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis. Subsequent cooling and full curing of the adhesive while still in the compressed condition stabilise the joint. 
     

     Anisotropic Conductive Adhesive Bonding is divided in two techniques:

    • Heat-Seal Bonding
      The Heat-Seal Bonding process is applied with flex materials, using adhesive pre-printed on the connector foil / flex foil.

    • Anisotropic Conductive Film bonding
      The ACF Bonding process is iused for fine-pitch applications (> 30 mircon) as the particle size is smaller than those of heat seal connectors (HSCs).

    Applications Heat-Sealing

     

     

    Heat-Sealing/ ACF Final bonding Benefits:

    • Lead-free process
       

    • Smallest pitch >30 micron possible
       

    • Flux free process
       

    • Electrical connections to glass substrates
       

    • No cleaning required after process
       

    • Low process temperatures

    Applications in Heat-Sealing/ACF Final bonding
    Our proven technologies enable the  Automotive, Medical, Defence, Aerospace, Electronics & Solar Cells, IT & Multimedia industries to heat-seal a variety of applications.

    Automotive IT & Multimedia Electronics & Solar Cells
     
     
    More information
     

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