• ACF Laminating/Pre-Bonding
  • B
  • Bolt & Studwelding
  • Brazing
  • C
  • Compacting
  • D
  • Dispensing
  • Drawn Arc Welding
  • E
  • Electrostatic Discharge Control
  • F
  • Fiber Laser Marking
  • Fiber Laser Welding
  • Fluid Dispensing
  • Fume Extraction
  • G
  • Gap Welding
  • Green Laser Welding
  • H
  • Heat Staking
  • Heat-Sealing/ACF Final Bonding
  • Hermetic Sealing of electronic packages
  • Hot Bar Bonding
  • Hot Bar Reflow Soldering
  • Hot Bar Systems
  • Hot Crimping
  • I
  • Induction Heating
  • Inscribe
  • Insulated Wire Welding
  • J
  • Jet Dispensing
  • L
  • Laser Cutting
  • Laser Marking
  • Laser Marking Systems
  • Laser Seam Welding
  • Laser Spot Welding
  • Laser Welding
  • Laser Welding Systems
  • M
  • Marking
  • Micro Joining
  • Micro Resistance Welding
  • P
  • Parallel Gap Welding
  • Plastic Welding
  • Projection Welding
  • R
  • Remote Services
  • Resistance Welding
  • Resistance Welding Systems
  • Robotic Soldering
  • S
  • Saw Blade System
  • Seam Welding
  • Short Cycle Studwelding
  • Single Component Positive Displacement Dispensing
  • Single Component Time/Pressure Dispensing
  • Spot Welding
  • Strand Welding
  • Studwelding
  • Studwelding with Capacitor Discharge
  • T
  • Thermocompression Welding
  • Two Component Dispensing
  • W
  • Weld Monitoring
  • Welding
  • Hermetic Sealing of Electronic Packages

    Precision components, RF packages, optoelectronic devices and sensors that need to be resistant towards challenging environmental conditions can be sealed into metal packages. AMADA MIYACHI EUROPE manufacturers the equipment to seal these metal packages by means of welding, brazing and soldering. The heat source for this process can be an electrical current or light from a laser. The seal can be made as a series of overlapping spots, as one- or more straight or circular lines and as a full circumference at once.

    These technologies are known in the industry as Resistance Welding, Projection Welding, Rotary Welding, Seam Sealing, Soldering and Laser Welding. AMADA MIYACHI EUROPE supplies products for these processes branded as Miyachi, Miyachi Unitek, Miyachi Benchmark.

          Hermetic sealing of electronic packages  

    Process Steps
    In all cases the base of the package is positioned. At that stage, the internals are already in place or will be placed in that position. The lid will be positioned, or it will be pre-positioned in a previous step. Once the lid, internals and base are in place, the internal atmosphere can be addressed. With the correct internal atmosphere, alignment and placement of parts done, the joint can be made. AMADA MIYACHI EUROPE supplies equipment for all these process steps: out baking, atmosphere, lid handling, lid placement, lid alignment and the final joint.

    Heat Sources
    The heat for the sources can be generated by means of an electrical current going through the package and using the electrical resistance of the package, or by directing concentrated light onto the package,  the metal of the package absorbs the light and is heated.

    The electrical energy and current can be as high as 10.000 Joules, or 50.000 amps. It can be generated by passing a DC or AC current through the parts. The heating time is typically very short, in the range of milliseconds. The current can be “direct energy” from the mains passing real-time though the power supply. The DC currents are used for the most precise process and current control. The AC has a longer minimal heating time (10ms or more) and is a simpler technology. The AC current can also be buffered in large capacitors (Capacitor Discharge Resistance Welding). This is typically used for the larger currents. Miyachi manufacturers and supplies all of these type of Resistance Welding power supplies.

    The light energy is typically generated by means of a laser. The laser has a collimated beam with only one wave length. Therefore it can be focused onto a small spot size, and enough energy density can be reached to melt metals. The laser beam is moved over the lid circumference to create a seal. The laser can be continuously switched on (CW lasers), or pulsed with pulses of  a few milliseconds length. The type of lasers can be Pulsed Nd-YAG lasers, Pulsed Fiber Lasers (Quasi Continuous Wave, or QCW lasers), or Continuous Wave Fiber lasers (CW Fiber lasers). The wave length is typically between 1060-1070nm but in certain applications a shorter wave length, like frequency doubled YAG lasers are beneficial. Miyachi manufacturers and supplies all these type of lasers.

    Joint Types
    The joint is either made all at once, or in a line progressing around the circumference. This line can be a continuous line, or made out of overlapping points. Typically smaller packages up to 25x25mm are joined all at once (TO-9, etc.) whereas larger packages are made with the line progressing around the package. This technology has no upper limit in dimensions, but most packages are below 250x250mm

    Projection welding is a joint that has a raised line. This raised line, or projection, is used for concentrating the electrical energy. It improves the joint quality and reduces the energy which is needed for making the joint.

    With Resistance Welding, the lid and the package are held with an electrode. This electrode positions the parts, feeds the electrical current to the part and pushes the parts together. The electrode can have a shape or cavity, to hold the lid and base part. It can also be a wheel that rolls over the joint. In this case the process is called Seam Sealing Electric Welding.
    Laser welding is a contact free process. This means the parts need to be positioned, and clamped together with external tooling.Typically this tooling holds the parts in place for the laser to make a few tacks or spots around the circumference. After these tacks are made, and the tooling is removed, the seam can be fully made.

    Seam sealing Titanium Medical Implant Laser Welding aluminium ultracapacitor

          Seam Sealing titanium medical implant

           Laser Welding aluminium ultracapacitor

    Atmosphere inside the Package
    The atmosphere in these packages can be ambient air or a dedicated atmosphere. A typical dedicated atmosphere would be argon, nitrogen, or a mix of gasses like argon with Helium as a sniffer gas to enable leak detection afterwards.

    This dedicated atmosphere can be determined before- during or after the welding. Most common is a full sized glovebox with an baking oven for drying/ dehydration/ curing the parts before welding. During the joining, parts can also be flushed with shielding gas. Parts can be laser welded in ambient air with a small hole or line left intentionally open. These parts can be placed into a small environmental chamber, receive a conditioned atmosphere in this chamber and get the final closing by making the last seal to close the seam, receive the last weld spot to close a pre-drilled small venting hole, or weld a small ball into a pre-drilled small venting hole.

    The pressure in such a cavity is normally normal ambient pressure (approximately one bar) but can also be lower (vacuum) or higher (pressurized packages).

    Typical enclosure materials are stainless steel, kovar (a nickel–cobalt ferrous alloy), aluminum, etc.

    Joint Process
    The weld can be a pure weld (fusing the two metals together), a brazing (melting a third interposer metal which is normally present as a coating) or a soldering (melting of a third metal, which has a low melting temperature of max. 300°C).

    Read the white paper "Laser Seam Sealing of Electronic and Opto-electronic Packages" for more information on materials and joint processes

    Alignment & Automation
    A passive alignment can be done in the tooling of either the parts itself, the tooling or the electrodes. An active alignment is possible with a camera system. This can be operated by the operator, or have an image recognition system where the computer automatically aligns the packages. This adds value to the system and improves operator independency and placement accuracy. 

    The parts will be be positioned and joined with a Miyachi system, and a solution will be designed and implemented to feed parts to- and from the system. AMADA MIYACHI EUROPE offers a wide range of automation solutions produced under MIYACHI UNITEK and MIYACHI EAPRO brands.

    Hermetic Seam Sealing applications





           Seam Weld on electronic package


    Seam Weld on ultracap


    Hermetic sealing of small TO, UM and HC styles


               Hermetic sealing of aerospace devices


    Hermetic Sealing applications
    The markets and products vary from radar- and anti-radar systems for defence, satellite navigation modules for aerospace, pressure sensors for automotive to sensors for electronics. Typical seam sealing examples are sensors, radar components, battery housing, conductors for thin film cells, pacemaker cases, insulin pump cases, etc.

    Our proven technologies enable the  Automotive, Electronics & Solar Cells,  IT & Multimedia, Medical, Aerospace and Defence industries to supply a variety of Seam Sealing applications.

    Medical Defence Aerospace




    Laser Welding Systems
    LMWS - Pulsed Fiber Laser Welding System
    NOVA1 Manual Desktop Workstation
    NOVA3 Laser Welding Workstations
    NOVA6 CNC Laser Welding Workstations
    Glovebox Laser Welding Systems
    Turnkey Solutions
    Parallel Seam Sealing System
    SM8500 Parallel Seam Sealing System
    Lid Placement, Tack & Seam Sealing System
    AF8500 Lid Placement, Tack & Seam Sealing System