• ACF Laminating/Pre-Bonding
  • B
  • Bolt & Studwelding
  • Brazing
  • C
  • Compacting
  • D
  • Dispensing
  • Drawn Arc Welding
  • E
  • Electrostatic Discharge Control
  • F
  • Fiber Laser Marking
  • Fiber Laser Welding
  • Fluid Dispensing
  • Fume Extraction
  • G
  • Gap Welding
  • Green Laser Welding
  • H
  • Heat Staking
  • Heat-Sealing/ACF Final Bonding
  • Hermetic Sealing of electronic packages
  • Hot Bar Bonding
  • Hot Bar Reflow Soldering
  • Hot Bar Systems
  • Hot Crimping
  • I
  • Induction Heating
  • Inscribe
  • Insulated Wire Welding
  • J
  • Jet Dispensing
  • L
  • Laser Cutting
  • Laser Marking
  • Laser Marking Systems
  • Laser Seam Welding
  • Laser Spot Welding
  • Laser Welding
  • Laser Welding Systems
  • M
  • Marking
  • Micro Joining
  • Micro Resistance Welding
  • P
  • Parallel Gap Welding
  • Plastic Welding
  • Projection Welding
  • R
  • Remote Services
  • Resistance Welding
  • Resistance Welding Systems
  • Robotic Soldering
  • S
  • Saw Blade System
  • Seam Welding
  • Short Cycle Studwelding
  • Single Component Positive Displacement Dispensing
  • Single Component Time/Pressure Dispensing
  • Spot Welding
  • Strand Welding
  • Studwelding
  • Studwelding with Capacitor Discharge
  • T
  • Thermocompression Welding
  • Two Component Dispensing
  • W
  • Weld Monitoring
  • Welding
  • Hot Bar Reflow Soldering

    Hot bar Reflow SolderingHot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated with heating element (called a thermode or a Hot bar) to a sufficient temperature to melt the solder. After this the parts are cooled below the solidification temperature to form a permanent electro-mechanical bond.

    The Hot Bar Reflow Soldering process

    For components that require a very precise positioning, Hot Bar Reflow Soldering is the most ideal process. Pulsed heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a thermode (or Hot Bar) which is heated and cooled down for each connection. Pressure is applied during the entire cycle including heating, reflow, and cooling. Because pressure is applied during the complete cycle, the process is very suitable for parts that could disconnect during cooling down.
    By using Hot Bar Reflow Soldering process multiple connections (up to > 100mm length) can be made simultaneously in a single process cycle. Making these connections simultaneously also prevents wires disconnecting while soldering the neighbouring one.

    Read our "Hot Bar Reflow Soldering Fundamentals" under MORE INFORMATION for a detailed process description, the possible applications and our system building capabilities. These are some basic guidelines, contact us for qualifying your process by testing it in our laboratory. Our proven technologies enable the  Automotive, Electronics & Solar Cells,  IT & Multimedia, Medical, Aerospace and Defence industries to solder a variety of applications by using Hot Bar Reflow Soldering as a key technology.

    Applications in Hot Bar Reflow Soldering
    Typical application examples  are connecting fex-foils to Printed Circuit boards, small wires, small coax cables and very light or small components.

    Applications Hot bar Reflow Soldering



    Hot Bar Reflow Soldering Benefits:

    • Fast temperature ramp-up and cool-down

    • Closed loop temperature control

    • Accurate positioning of the parts

    • Multiple connections can be made simultaneously

    • Cost effective due to elimination of third component such as connector

    Our proven technologies enable the Automotive, Electronics & Solar Cells,  IT & Multimedia, Medical, Aerospace and Defence industries to supply a variety of Hot Bar Reflow Soldering applications. Our AMADA MIYACHI EUROPE Hot Bar Reflow Soldering products are designed especially for Hot Bar Soldering of flex circuits, TAB and flexible connectors onto PCB's.



    Electronics & Solar Cells




    More information


    MIYACHI EAPRO Reflow Soldering Desktop Systems
    DT-250-PH & DT-260-PH Uni-Slide Desktop Systems
    DT-270-PH Uni-Slide Desktop System
    DT-350-PH & DT-360-PH Uni-Slide Desktop Systems
    DT-370-PH Uni-Slide Desktop System
    DT-440-PH & DT-450-PH Uni-Turn Desktop Systems
    newhorizon Hot Bar Desktop Series
    newhorizon Pulsed Heat Reflow Soldering System
    newhorizon Heat-Seal Bonding System CH
    newhorizon Heat-Seal Bonding System PH
    newhorizon ACF Laminating System
    MIYACHI EAPRO Reflow Soldering Stand-alone Systems
    Uni-Base Stand-alone System
    Uni-Slide Stand-alone System
    Uni-Slide Plus Stand-alone System
    Uni-Turn Stand-alone System
    Uni-Turn Plus Stand-alone System