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Technologies

 

TECHNOLOGY LIBRARY

A
  • ACF Laminating/Pre-Bonding
  • B
  • Bolt & Studwelding
  •  
  • Brazing
  • C
  • Compacting
  • D
  • Dispensing
  •  
  • Drawn Arc Welding
  • E
  • Electrostatic Discharge Control
  • F
  • Fiber Laser Marking
  •  
  • Fiber Laser Welding
  •  
  • Fluid Dispensing
  •  
  • Fume Extraction
  • G
  • Gap Welding
  •  
  • Green Laser Welding
  • H
  • Heat Staking
  •  
  • Heat-Sealing/ACF Final Bonding
  •  
  • Hermetic Sealing of electronic packages
  •  
  • Hot Bar Bonding
  •  
  • Hot Bar Reflow Soldering
  •  
  • Hot Bar Systems
  •  
  • Hot Crimping
  • I
  • Induction Heating
  •  
  • Inscribe
  •  
  • Insulated Wire Welding
  • J
  • Jet Dispensing
  • L
  • Laser Cutting
  •  
  • Laser Marking
  •  
  • Laser Marking Systems
  •  
  • Laser Seam Welding
  •  
  • Laser Spot Welding
  •  
  • Laser Welding
  •  
  • Laser Welding Systems
  • M
  • Marking
  •  
  • Micro Joining
  •  
  • Micro Resistance Welding
  • P
  • Parallel Gap Welding
  •  
  • Plastic Welding
  •  
  • Projection Welding
  • R
  • Remote Services
  •  
  • Resistance Welding
  •  
  • Resistance Welding Systems
  •  
  • Robotic Soldering
  • S
  • Saw Blade System
  •  
  • Seam Welding
  •  
  • Short Cycle Studwelding
  •  
  • Single Component Positive Displacement Dispensing
  •  
  • Single Component Time/Pressure Dispensing
  •  
  • Spot Welding
  •  
  • Strand Welding
  •  
  • Studwelding
  •  
  • Studwelding with Capacitor Discharge
  • T
  • Thermocompression Welding
  •  
  • Two Component Dispensing
  • W
  • Weld Monitoring
  •  
  • Welding
  • Hot Bar System

    Hot bar systemAMADA MIYACHI EUROPE Hot Bar systems can be used for Hot Bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking. Hot Bar systems include constant heat or pulsed heat process technology.

    Using the Thermode technology as the heart of our Hot Bar system with precise temperature, force and process control, the Miyachi Hot Bar systems create a robust and multi-functional platform for Hot Bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking applications.

    These processes are the preferred solution for Reflow Soldering thermally-sensitive components such as computer chips and connectors. The same Hot Bar systems are also ideal for Heat-Sealing / ACF Bonding of flexible connections between LCD and PCB components and Heatstaking of plastic modules. AMADA MIYACHI EUROPE designs and produces a full range of automated workstations for both processes.

    In addition to our range of standard systems, AMADA MIYACHI EUROPE offers equipment modifications for existing specifications and customised systems to meet your specific needs.

    Contact AMADA MIYACHI EUROPE to find out how to implement a Hot bar system intoyour production process. 

    Hot Bar System Configurations

    Hot bar System Configurations

     

     Hot Bar System Benefits:
     

    • Turn-Key deliverables

    • Customised Hot Bar application solutions

    • On-site system integration, qualification and training

    • Applications expertise and global support


    Hot Bar System Features:

    •  Process data traceability and storage

    • Alignment and positioning modules

    • Visual inspection systems

    • Functional product-test modules

    • Dispensing modules

    • Parts feeding

    • Product handling and positioning

    • Closed loop process quality control

    • Process development

    Our proven technologies enable the Automotive, Electronics & Solar Cells, IT & Multimedia, Medical, Aerospace and Defence industries to laser weld a variety of applications.

    Automotive Medical IT & Multimedia

     

     
     
     

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